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| Process: |
| Resist Lithography |
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| Via Generation |
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| Photoablation |
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| Crystallization |
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Application: |
| Displays |
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| Flexible Circuits |
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| Printed Circuit Boards |
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| Multi-Chip Modules |
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| Wafer-Level Packaging |
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| Nozzle Arrays |
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| Underlined systems link to more details |
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| Illumination: |
| High-Power Laser |
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| Medium-Power Laser |
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| Low-Power Laser |
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Key Parameters: |
| Max substrate size (mm) |
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| Resolution (microns) |
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| Wavelength (nm) . |
System Price: |
| Price Range (depends on options selected) |
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2100 SPE |
2150 SXE |
4050 SXE |
2020 SXE |
1010 SDE |
3100 SRE |
2050 SME |
1100 SWE |
NexStep 1020 SXE |
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| 2100 SPE |
2150 SXE |
4050 SXE |
2020 SXE |
1010 SDE |
3100 SRE |
2050 SME |
1100 SWE |
NexStep 1020 SXE |
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| (Note 1) | (Note 2) | (Note 3) | (Note 4) | (Note 5) | (Note 6) | (Note 3) | 300 dia. | (Note 7) |
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| 10 | 15 | 5 | 2 | 1 | 10 | 5 | 10 | 2 |
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| 351 or 308 |
351 or 308 |
248 | 248 | 351 or 308 |
351 or 308 |
351 | 308 or 248 |
351, 308 or 248 |
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| $750K to 1.2M |
$800K to 1.3M |
$1.5M to 2.2M |
$1.1M to 1.5M |
$1.4M to 2.0M |
$1.3M to 2.2M |
$950K to 1.4M |
$750K to 1.2M |
$350K to 400K |
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Notes
(1) Systems available for 610 x 915 mm and larger panel sizes up to 1100 x 1250 mm. Scalable to 1500 x 1800 mm.
(2) Systems available for 460 x 610 mm and larger panel sizes up to 1100 x 1250 mm. Scalable to 1500 x 1800 mm.
(3) Systems available for 610 x 610 mm and larger panel sizes up to 1100 x 1250 mm. Scalable to 1500 x 1800 mm.
(4) 500 x 500 mm sq. and 300 mm dia.
(5) Systems available for 250 x 350 mm and larger panel sizes up to 610 x 610 mm.
(6) For patterning continuous, roll-fed substrates of widths up to 610 mm (24 inches).
(7) For patterning any substrate size or shape up to 300 mm dia. or 300 x 300 mm.
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Anvik's advanced optical systems currently include large-area lithography and via-generation machines for high-throughput production of flat-panel displays, multi-chip modules and printed circuit boards. Anvik's advanced optical systems currently include large-area lithography and via-generation machines for high-throughput production of flat-panel displays, multi-chip modules and printed circuit boards.