The Anvik HexScan^TM 2100 SPE laser projection imaging (LPI) system represents a revolutionary advance in large-format lithography systems. It offers the unique combination of high-resolution projection imaging, large-area substrate handling, and high-precision alignment, making it the ideal exposure tool for cost-effective, volume manufacturing of high-performance printed circuit boards. With its excimer laser illumination source emitting 40 - 50 watts of UV radiation, this high-throughput system serves both as a primary imaging tool for conventional dry-film or liquid resists, and as an efficient exposure system for solder masks and other layers requiring high doses.

• Designed for projection imaging of board sizes up to 610 x 915 mm (24 x 36 inches) and larger (1100 x 1250 mm); scalable to 1500 x 1800 mm.

• Capable of handling panels of a wide range of thicknesses, with no mask-to-panel contact

• Ideal for imaging rigid and flexible substrates, and both inner and outer layers
  
  
  
  

• Resolution of 10 micron (0.4 mil) features (lines, spaces, holes)

• Patented seamless scanning technology (HexScan^TM) delivers lens resolution over entire panel

• Fully automatic alignment with precision of + 2.5 microns (+ 0.1 mil) for layer-to-layer, front-to-back, or mask-to-board registration
  
  
  
  

• Seamless scanning with large-area hexagonal illumination beam

• High-power excimer laser illumination system

• Single-planar, high-speed, high-precision scanning stage
  
  
  
  

• Delivers very high throughput for lithography in a wide range of photoresist materials

• Capable of patterning with a variety of mask materials, including mylar, glass, and fused silica

• Capable of batch via generation in a variety of polymeric dielectrics
  
  
  
  

• Modular design enables user to define optimum system configuration

• Available with Anvik's patented independent x-y scaling capability (up to 5000 ppm) to compensate for process-induced dimensional changes in panel (see ref. 3 below)

• Available with Anvik's patented Variable-Area Substrate Tiling (VAST^TM) technology to populate panel with modules of different sizes
  
  
  
  
  

1. K. Jain et al., "High-Speed, High-Resolution, Large-Area Exposure System for PCB Patterning," Printed Circuit Fabrication, Vol. 20, No. 5, p. 34, May 1997.
   
   
2. K. Jain et al., "Large-Area, High-Resolution Lithography and Photoablation Systems for Microelectronics and Optoelectronics Fabrication", Proc. IEEE, Vol. 90, No. 10, p. 1681, Oct. 2002. [Click here for a pdf copy of this paper.]
   
   
3. M. Zemel et al., "X-Y Scaling Compensation Technology for Fine-Line PCB Imaging with High-Precision Alignment", IPC Printed Circuit Expo, Proc. of Technical Conf., p. S03-1-1, Long Beach, CA, Mar. 26-28, 2002. [Click here for a pdf copy of this paper.]
   
   
4. K. Jain et al., "Large-Area, High-Throughput, High-Resolution Lithography Systems for Flat-Panel Displays and Microelectronic Modules," Proc. SPIE, Vol. 3331, p. 197, 1998.
   
   
5. K. Jain, Large-Area, High-Throughput, High-Resolution Projection Imaging System, U.S. Pat. 5,285,236, issued Feb. 8, 1994.
   
   
6. K. Jain, Scan and Repeat High Resolution Lithography System, U.S. Pat. 4,924,257, issued May 8, 1990.

View Examples of Results

Limitations of Other Lithography and Via Generation Tools

Return to Models Overview