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Ideal for high-throughput, high-volume photoablation on large panels
The Anvik HexScanTM 4050 SXE patterning system represents a revolutionary advance in large-panel photoablation systems especially targeted towards the needs of the microelectronic packaging and flat-panel display industries. It offers the attractive combination of high-resolution and high-throughput projection patterning and photoablation structuring of polymers, polymer composites and thin-film metals, making it the ideal patterning tool for high-volume, cost-effective production of advanced microelectronic modules, optoelectronic devices, communication electronics, and displays. With its unique variable-area substrate tiling (VASTTM) technology, which enables processing of different multiple-up module configurations, this high-throughput system serves as a volume-production photoablation patterning system for diverse substrate materials used by the current industry for a wide range of microelectronic and optoelectronic devices. The modular design of the system also provides equipment upgradability and choice of user-specified system configurations suitable for different feature resolutions and panel sizes, including roll-to-roll processing.
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Large-format substrate handling
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- Designed for projection patterning on panel sizes of 508 x 508 mm (20 x 20 inches) and larger (1100 x 1250 mm); scalable to 1500 x 1800 mm.
- Capable of handling substrates of a wide variety of materials and thicknesses
- Easily upgradable for roll-to-roll patterning on flex materials
- Automated mask-substrate alignment and part handling minimizes overhead time
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High resolution
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- Resolution of 5 microns (0.2 mil) or better (lines, spaces, holes) for photoablation
- High resolution enables excellent line-edge definition and ablation profiles
- Patented seamless scanning technology (HexScanTM) delivers lens resolution over entire panel
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Very high exposure throughput
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Different exposure throughputs available based on customer needs. High throughputs made possible by:
- Seamless scanning with hexagonal illumination
- Efficient excimer laser illumination system
- High-speed, high-precision scanning stage
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Versatility
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- Delivers very high throughput for photoablation in a wide variety of substrate materials
- Enables prototyping of different substrates and module sizes for electronic and opto-electronic devices
- Patented Variable-Area Substrate Tiling (VASTTM) technology enables multiple-up substrate configuration
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Modularity and upgradability
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- Modular design enables user to define ideal system configuration
- Customer may specify resolution, substrate type and size parameters, and exposure wavelength
- Easily upgradable for roll-to-roll patterning on flex materials
- Upgradability of key subsystems extends system life over multiple product generations
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HexScanTM 4050 SXE Specifications
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| Imaging Technique |
Seamless scanning projection |
| Resolution |
5 microns (0.2 mil) or better for photoablation |
| Projection System |
1:1 magnification refractive lens |
| Depth of Focus |
76 microns (3 mils) for 5 micron resolution |
| Substrate Size |
Up to 500 x 500 mm (20 x 20 in), with or without tiling |
| Illumination Source |
KrF excimer laser (other sources optional) |
| Exposure Wavelength |
248 nm (other wavelengths optional) |
| Overlay Precision |
2 micron (0.08 mil); upgradable to 1 micron |
| Alignment System |
Automatic |
| Substrate Handling |
Multiple-up module configuration, with variable-area substrate tiling (VASTTM) |
| Exposure Throughput |
Dependent on material ablation characteristics; contact Anvik for details |
| System Price |
USD 1.5 - 2.2M |
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Scanning electron micrograph showing 12 µm wide traces and 250 µm diameter pad lands patterned by photoablation in 15 µm thick polyimide with the Anvik HexScanTM 4050 SXE high-throughput, high-resolution, large-area photoablation system.
For additional information:
- R. Huemoeller et al., "Unveiling the Next Generation in Integrated Circuit Substrate Circuit Formation," CircuiTree, Vol. 20, No. 6, p. 14, June 2007. [Click here for a pdf copy of this article.]
- M. Klosner et al., "High-Resolution, Large-Area Projection Lithography Offers a New Alternative for Wafer-Level Packaging", Chip Scale Review, Vol. 6, No. 4, p. 75, Jul. 2002. [On the web: www.ChipScaleReview.com]
- K. Jain et al., "Large-Area, High-Resolution Lithography and Photoablation Systems for Microelectronics and Optoelectronics Fabrication", Proc. IEEE, Vol. 90, No. 10, p. 1681, Oct. 2002. [Click here for a pdf copy of this paper.]
- "New Patterning Technology Makes Faster Electronics, Sharper Displays," BMDO Update (U.S. Dept. of Defense, Ballistic Missile Defense Organization, Newsletter of the Technology Applications Program), Issue No. 37, Spring 2001, p. 8. [Click here for a pdf copy of this article.]
- K. Jain, Large-Area, High-Throughput, High-Resolution Projection Imaging System, U.S. Pat. 5,285,236, issued Feb. 8, 1994.
- T. Dunn, N. Farmiga and K. Jain, Projection Patterning of Large Substrates Using Limited-Travel X-Y stage, U.S. Pat. 5,897,986, issued Apr. 27, 1999.
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Schematic of Core System Technology