The Anvik HexScan^TM 1100 SWE wide-field laser lithography system represents a revolutionary advance in patterning systems for wafer-level packaging applications. It offers the unique combination of high-resolution projection imaging, high-precision alignment, and ability to handle silicon wafers and other substrates up to 300 mm in size, making it the ideal exposure tool for cost-effective, volume manufacturing of wafer-level products and other high-performance electronic packages. With its excimer laser illumination source, seamless imaging over the entire wafer area, and automatic wafer loading and unloading, this high-throughput system eliminates the limitations of other exposure tools such as contact and proximity printers, steppers and direct writers.

• Designed for projection imaging of silicon wafers of diameters up to 300 mm and other substrates of sizes up to 300 x 300 mm

• Ideal for handling substrates of a wide range of thicknesses, including very thin wafers (down to 150 µm thickness)

• Capable of exposing large package sizes, addressing the requirements of WLP, SOC, MEMS, and integrated optoelectronic packages

• Capable of imaging rigid and flexible substrates, with no mask-to-substrate contact

• Automatic wafer and mask handling capability
  
  
  

• Resolution of 10 micron (0.4 mil) features (lines, spaces, holes)

• Patented seamless scanning technology (HexScan^TM) delivers specified resolution over entire substrate

• Fully automatic high-speed alignment with precision of + 2.5 microns (+ 0.1 mil) for mask-to-wafer and layer-to-layer registration
  
  
  
  

• Seamless scanning with large-area hexagonal illumination beam

• Excimer laser illumination system

• Single-planar, high-speed, high-precision scanning stage
  
  
  
  

• Delivers very high throughput for lithography in a wide range of thin and thick photoresist materials

• Capable of patterning with a variety of mask materials, including glass, fused silica and mylar

• Provides large DOF for exposures in thick resists and increased tolerance of non-planar substrates

• Capable of robotic handling of rigid and non-rigid substrates
  
  
  
  

• Available in resolution capability down to 1 µm

• Robotic interface is customizable to enable handling of substrates of different sizes and shapes

• Available with Anvik's patented independent x-y scaling capability (up to 5000 ppm) to compensate for process-induced dimensional changes in substrate (see Ref. 3 below)
  
  
  
  
  

1. K. Jain et al., "Large-Area, High-Resolution Lithography and Photoablation Systems for Microelectronics and Optoelectronics Fabrication", Proc. IEEE, Vol. 90, No. 10, p. 1681, Oct. 2002. [Click here for a pdf copy of this paper.]
   
   
2. M. Klosner et al., "High-Resolution, Large-Area Projection Lithography Offers a New Alternative for Wafer-Level Packaging," Chip Scale Review, Vol. 6, No. 4, p. 75, July 2002. [Click here to view full paper.]
   
   
3. K. Jain et al., "Large-Area Excimer Laser Lithography and Photoablation Systems", Microlithography World, Vol. 11, No. 3, p. 8, Aug. 2002. [Click here for a pdf copy of this paper.]
   
   
4. K. Jain et al., "Large-Area, High-Throughput, High-Resolution Lithography Systems for Flat-Panel Displays and Microelectronic Modules," Proc. SPIE, Vol. 3331, p. 197, 1998.
   
   
5. K. Jain, Large-Area, High-Throughput, High-Resolution Projection Imaging System, U.S. Pat. 5,285,236, issued Feb. 8, 1994.

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