Anvik Corporation's laser projection lithography and via-generation systems are designed for high-throughput production of a variety of microelectronic products that require high-resolution imaging with fine alignment on large-area substrates, including: flat-panel displays, prinetd circuit boards, flexible electronics, flexible displays, microvia products, wafer-level packages, microsystems, and optoelectronic devices. Anvik's technical team has authored several articles on these applications, some of which are listed below.

1. J. Chae et al., "Patterning of Indium Tin Oxide by Projection Photoablation and Lift-Off Process for Fabrication of Flat-Panel Displays ", Appl. Phys. Lett., Vol. 90, No. 26, p. 261102, June 25, 2007. [Click here for a pdf copy of this article.]
   
   
2. R. Huemoeller et al., "Unveiling the Next Generation in IC Substrate Circuit Formation", CircuiTree, Vol. 20, No. 6, p. 14, June 2007. [Click here for a pdf copy of this article.]
   
   
3. K. Jain et al., "Flexible Electronics and Displays: High-Resolution, Roll-to-Roll, Projection Lithography and Photoablation Processing Technologies for High-Throughput Production", Proc. IEEE, Vol. 93, No. 8, p. 1500, Aug. 2005. [Click here for a pdf copy of this article.]
   
   
4. K. Jain et al., "Large-Area, High-Resolution Lithography and Photoablation Systems for Microelectronics and Optoelectronics Fabrication", Proc. IEEE, Vol. 90, No. 10, p. 1681, Oct. 2002. [Click here for a pdf copy of this paper.]
   
   
5. K. Jain et al., "Large-Area Excimer Laser Lithography and Photoablation Systems", Microlithography World, Vol. 11, No. 3, p. 8, Aug. 2002. [Click here for a pdf copy of this paper.]
   
   
6. M. Klosner et al., "High-Resolution, Large-Area Projection Lithography Offers a New Alternative for Wafer-Level Packaging", Chip Scale Review, Vol. 6, No. 4, p. 75, Jul. 2002. [See also: www.ChipScaleReview.com]
   
   
7. M. Zemel et al., "X-Y Scaling Compensation Technology for Fine-Line PCB Imaging with High-Precision Alignment", IPC Printed Circuit Expo, Proc. of Technical Conf., p. S03-1-1, Long Beach, CA, Mar. 26-28, 2002. [Click here for a pdf copy of this paper.]
   
   
8. K. Jain et al., "High-Speed, High-Resolution, Large-Area Exposure System for PCB Patterning," Printed Circuit Fabrication, Vol. 20, No. 5, p. 34, May 1997.
   
   
9. M. Robertsson et al., "Large-area patterning of high-density interconnects by novel UV-excimer lithography and photo-patternable ORMOCER^TM dielectric," presented at the International Microelectronics and Packaging Society (IMAPS) Conference, Strasbourg, France, May 30-June 1, 2001. [Click here for a pdf copy of this paper.]
   
   
10. K. Jain et al., "Large-Area, High-Throughput, High-Resolution Lithography Systems for Flat-Panel Displays and Microelectronic Modules," Proc. SPIE, Vol. 3331, p. 197, 1998.
    
    
11. K. Jain et al., "Lithography on Flexible Substrates: A Roll-to-Roll, High-Throughput, High-Resolution System for Low-Cost Production of Microelectronics," Proc. SPIE, Vol. 3331, p. 207, 1998.
    
    
12. K. Jain, "A Novel High-Resolution, Large-Field, Scan-and-Repeat Projection Lithography System," Proc. SPIE, Vol. 1463, p. 666, 1991.
    
    

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